IC Bending Machine

Our IC Bending Machine is an indispensable tool for electronics manufacturing, designed to streamline the lead preparation process for integrated circuits (ICs) with precision and efficiency. This state-of-the-art machine offers unmatched flexibility and accuracy for bending IC leads to fit a wide range of circuit board layouts. Whether you’re working with DIP (Dual In-Line Package) or SMD (Surface-Mount Device) ICs, our IC bending machine ensures flawless lead alignment, reducing the risk of soldering errors and enhancing the overall quality of your electronic assemblies.

 Key Features:

  •   Adjustable bending parameters
  •   Versatile compatibility.
  •   Batch processing capability.
  •   Rugged construction.
  •   Easy  maintenance.


  •   Input Power : 600W. 1 PH, N, E
  •   Weight : Approx. 300 Kg
  •   Operating Pressure : 6 Bar
  •   Drive System: Electrical Drive

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