Our IC Bending Machine is an indispensable tool for electronics manufacturing, designed to streamline the lead preparation process for integrated circuits (ICs) with precision and efficiency. This state-of-the-art machine offers unmatched flexibility and accuracy for bending IC leads to fit a wide range of circuit board layouts. Whether you’re working with DIP (Dual In-Line Package) or SMD (Surface-Mount Device) ICs, our IC bending machine ensures flawless lead alignment, reducing the risk of soldering errors and enhancing the overall quality of your electronic assemblies.
Key Features:
- Adjustable bending parameters
- Versatile compatibility.
- Batch processing capability.
- Rugged construction.
- Easy maintenance.
Specifications:
- Input Power : 600W. 1 PH, N, E
- Weight : Approx. 300 Kg
- Operating Pressure : 6 Bar
- Drive System: Electrical Drive
